We invite you to visit the Electronic Components and Technology Conference (ECTC) from May 27 to 30 in Dallas.Â
Together with imac we will give a presentation on 'Development and Characterization of Electrodeposited Tin-Indium Alloy Microbumps for Low Temperature Assembly' during the Interactive Presentations 3 on Thursday May 29 10:00 AM — 12:00 PM.
For more details on the session and the show, please visit the official ECTC website.